XCVU13P, 2FLGA2577777777. UltraSc English + ™ in fabrica providet summum perficientur et integrated functionality in 14nm / 16nm finfet nodi. AMD scriptor tertia-generation 3D IC usus reclinant silicii Interconnect (SSI) Technology ad conteram limitations of Moore de lege et consequi summum signum processus et Vide i / O requisitis
XCZU19EG, 2ffvd1760i Zynq® UltraScale + ™ MPSOC multiprocessors habere LXIV frenum processus scalability, combining real-vicis imperium cum software et hardware engines, idoneam ad graphics, video, waveforme, quod packet in processus. Hoc multiprocessor ratio in chip fabrica fundatur in platform instructa cum generali-ad realis-vicis processus et programmable logica
Xczu4eg-1SFVC784E secundum Xilinx ® UltraSc architectura. Haec series ex products integrata pluma dives LXIV frenum Quad Core vel Dual Core Army ® Cortex-A53 et Dual Core brachium Cortex-R5F Processing System (Ex Xilinx) ® ® MPSOC Architecture). Processing System (Psal) and Xilinx Programmable Logica (PL) Ultrascale Architecture. Praeterea etiam includit in-chip memoria, multi Portus externum Memoria interfaces et dives periphericis nexu interfaces.
Et XCZU4CG-1SFVC784E multiprocessor habet LXIV frenum processus scalability et combines realis-vicis control cum software et hardware engines, faciens idoneam ad graphics, video, waveforms, et packet processui applications. Hoc multiprocessor ratio in chip fabrica fundatur in platform instructa cum generali-ad realis-vicis processus et programmable logica
In XCZU3CG, 2SBVA484I multiprocessor habet LXIV frenum processus scalability et combines realis-vicis imperium cum software et hardware machinamenta, faciens idoneam ad graphics, video, waveforms, et packet processui applications.
XCZU7EG, 1FBVB900I - Zynq® UltraSc + ™ MPSOC Multi-Core Processor
