XCZU19EG-2FFVD1760I Zynq® UltraScale+™ MPSoC multiprocessores habent 64 frenum processus scalabilitatis, temperamentum reale componens cum machinis programmatis et ferramentis, graphicis, video, waveformibus, ac fasciculus applicationum processus congruorum. Haec multiprocessoris ratio in chip fabrica fundatur in suggestu instructo cum universali proposito processus real-time et logica programmabilis
XCZU19EG-2FFVD1760I Zynq® UltraScale+™ MPSoC multiprocessores habent 64 frenum processus scalabilitatis, temperamentum reale componens cum machinis programmatis et ferramentis aptum ad graphica, video, waveforma, ac fasciculum applicationum processus. Multiprocessoris ratio haec in chip fabrica fundatur in suggestu instructo processu generali et proposito reali-temporis logicae programmabilis. Multiprocessoris UltraScale+MPSoC tria exempla (coro dual, quad core, et vide code-c) comprehendit. Inter eas machinae instructae cum applicatione nucleorum processuum (EG) bene operantur in infrastructura wired et wireless centris, nec non aerospace et applicationes defensionis.
technical specifications
Architecture: MCU, FPGA
Core processus: cum CoreSight™ Core quadrum ARM ® Cortex®-A53 MPCore™， CoreSight™ Core ARM ® Cortex™-R5，ARM Mali™-400 MP2
I/O comitem: 308
Flash size: -
RAM size: 256KB
Peripherales: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
Velocitas: 533MHz, 600MHz, 1.3GHz
Praecipuum attributum: Zynq ® UltraScale+FPGA, 1143K+ paginis logicis
Temperatus operandi: -40 ° C~ C° C (TJ)
Packaging/Shell: 1760-BBGA, FCBGA
Supple Device Packaging: 1760-FCBGA (42.5x42.5)
