XCVU13p, 2flga2577

XCVU13P, 2FLGA2577777777. UltraSc English + ™ in fabrica providet summum perficientur et integrated functionality in 14nm / 16nm finfet nodi. AMD scriptor tertia-generationem 3D IC usus reclinant silicii Interconnect (SSI) Technology ad conteram limitations de Moore de lege et consequi summum signum processus et Vide I / O Bandwidth in occursum cum Serial Mihi. Etiam providet virtual una-chip consilio amet providere descripserunt fuso lineas inter eu, enabling operationem supra 600mhz et offering ditioribus et magis flexibile horologiorum.

Ut maxime potens FPGA series in industria, Ultrascale + cogitationes sunt perfecta arbitrium ad computationally intensive applications, vndique a I + TB / s retiacula, apparatus discendi ad radar / Monitum systems.

applicatio

Calculation acceleratio

5G baseband

filum communicationis

radar

Testis et mensuram

Main Features et commoda

3D-on-3D integrationem:

-Finfet supporting 3D IC apta breakthrough density, sed magna-scale mori mori hospites et sustinet virtutis una-chip consilio

Integrated cuneos PCI Express:

-Gen3 X16 Integrated PCIE ad 100g Applications ® modular

Enhanced DSP core:

-Up ad XXXVIII (XXII Teramac) de DSP fuisse optimized ad certa natantis punctum calculations, inter int8, ad plene obviam necessitatibus AI consequentia

Memoria:

-D -dis -dentr4 in-chip memoria cache celeritates ad 2666MB / s et usque ad 500MB, providing altior efficientiam et humilis latency

32.75GB / Ter transceiver:

-Up ad CXXVIII Transceivers in fabrica - backplane, chip ad optical fabrica, chip ad chip functionality

Asic Level Network IP:

-150g interlaken, 100g Aer Mac core, capax summus celeritas nexu