XCZU19EG-3FFVC1760E Zynq™ UltraScale+™ MPSoC machinas habent 64 frenum processus scalabilitatis, temperamentum reale componens cum machinis programmatis et ferramentis, et aptae sunt applicationibus graphicis, video, waveformibus, et fasciculus applicationum processus.
XCZU19EG-3FFVC1760E Zynq™ UltraScale+™ MPSoC machinas habent 64 frenum processus scalabilitatis, temperamentum reale componens cum machinis programmatis et ferramentis, et aptae sunt applicationibus graphicis, video, waveformibus, fasciculus processus. Multiprocessoris UltraScale+MPSoC tria exempla (coro dual, quad core, et vide code-c) comprehendit. Machinae instructae cum nucleo applicationis processuum (EG) bene operantur in infrastructura wired et wireless centris, data centris, nec non applicationibus aerospace et defensione.
Product specifications
I/O comitem: 512
Architecture: MCU, FPGA
Core processus: cum CoreSight™ Core quadrum ARM ® Cortex®-A53 MPCore™, CoreSight™ Core ARM ® Cortex™-R5,ARM Mali™-400 MP2
Flash size: -
RAM size: 256KB
Peripherales: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG
Celeritas: 600MHz, 667MHz, 1.5GHz
Praecipuum attributum: Zynq ® UltraScale+FPGA, 1143K+ paginis logicis
Temperatus operandi: 0° C~C° C (TJ)
Packaging/Shell: 1760-BBGA, FCBGA
Supple Device Packaging: 1760-FCBGA (42.5x42.5)
Basic Product Code: XCZU19