XCZU19EG-3FFVC1760E

XCZU19EG-3FFVC1760E

XCZU19EG-3FFVC1760E Zynq™ UltraScale+™ MPSoC machinas habent 64 frenum processus scalabilitatis, temperamentum reale componens cum machinis programmatis et ferramentis, et aptae sunt applicationibus graphicis, video, waveformibus, et fasciculus applicationum processus.

Model:XCZU19EG-3FFVC1760E

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XCZU19EG-3FFVC1760E Zynq™ UltraScale+™  MPSoC machinas habent 64 frenum processus scalabilitatis, temperamentum reale componens cum machinis programmatis et ferramentis, et aptae sunt applicationibus graphicis, video, waveformibus, fasciculus processus. Multiprocessoris UltraScale+MPSoC tria exempla (coro dual, quad core, et vide code-c) comprehendit. Machinae instructae cum nucleo applicationis processuum (EG) bene operantur in infrastructura wired et wireless centris, data centris, nec non applicationibus aerospace et defensione.

Product specifications

I/O comitem: 512

Architecture: MCU, FPGA

Core processus: cum CoreSight™   Core quadrum ARM ®   Cortex®-A53 MPCore™, CoreSight™   Core ARM ® Cortex™-R5,ARM Mali™-400 MP2

Flash size: -

RAM size: 256KB

Peripherales: DMA, WDT

Connectivity: CANbus, EBI/EMI, Ethernet, I²C,MMC/SD/SDIO,SPI,UART/USART,USB OTG

Celeritas: 600MHz, 667MHz, 1.5GHz

Praecipuum attributum: Zynq ® UltraScale+FPGA, 1143K+ paginis logicis

Temperatus operandi: 0° C~C° C (TJ)

Packaging/Shell: 1760-BBGA, FCBGA

Supple Device Packaging: 1760-FCBGA (42.5x42.5)

Basic Product Code: XCZU19


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