XCZU11EG-2FFVC1760I series innixa est architecturae Xilinx ® UltraScale MPSoC. Haec series productorum plumam divitem integrat 64 frenum quadrum nucleum vel nucleum dualem in una fabrica ® Cortex-A53 et nucleus brachii Cortex-R5F systematis fundamentalis processus (PS) et logica programmabilis Xilinx (PL) architectura UltraScale. Praeterea, etiam in- chip memoriae, multi portum memoriae externae interfaciunt, et nexum periphericum interfaces dives.
XCZU11EG-2FFVC1760I seriei Xilinx innititur ® Ultra Scala MPSoC architectura. Haec series productorum plumam locupletem integrat 64 bis nucleum quadrum vel nucleum dualem in una fabrica ® Cortex-A53 et nucleum duplicale Brachium Cortex-R5F systematis fundamentalis processus (PS) et architectura Xilinx programmabilis logica (PL) UltraScale. Praeterea, etiam in- chip memoriae, multi portum memoriae externae interfaciunt, et nexum periphericum interfaces dives.
attributum
Series: Zynq ® UltraScale+™ MPSoC EG
Architecture: MCU, FPGA
Core processus: cum CoreSight™ Core quadrum ARM ® Cortex®-A53 MPCore™， CoreSight™ Core ARM ® Cortex™-R5，ARM Mali™-400 MP2
Flash size: -
RAM size: 256KB
Peripherales: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I²C，MMC/SD/SDIO，SPI，UART/USART，USB OTG
Velocitas: 533MHz, 600MHz, 1.3GHz
Praecipuum attributum: Zynq ® UltraScale+FPGA, 653K+logicae unitates
Temperatus operandi: -40 ° C~ C° C (TJ)
Packaging/Shell: 1760-BBGA, FCBGA
Supple Device Packaging: 1760-FCBGA (42.5x42.5)
I/O comitem: 512
