XCVU13p, 3FHGC2104E Virtex ™ + UltraScale + ™ quam maxime potens FPGA series in industria, Ultrascale + cogitationes sunt perfecta choice pro computationis intensionum applications, vndique a I + TB / s retiacula, apparatus ad radar / Monitum systems.
XCVU13p, 3FHGC2104E Virtex ™ + UltraScale + ™ quam maxime potens FPGA series in industria, Ultrascale + cogitationes sunt perfecta choice pro computationis intensionum applications, vndique a I + TB / s retiacula, apparatus ad radar / Monitum systems.
Haec serie cogitationes providet summum perficientur et integrated functionality in 14nm / 16nm finfet nodis. AMD scriptor tertia-generationem 3D IC usus reclinant silicii Interconnect (SSI) Technology ad conteram limitations de Moore de lege et consequi summum signum processus et Vide I / O Bandwidth in occursum cum Serial Mihi. Etiam providet virtual una-chip consilio amet providere descripserunt fuso lineas inter eu, enabling operationem supra 600mhz et offering ditioribus et magis flexibile horologiorum.
Main Features et commoda
3D-on-3D integrationem:
-Finfet supporting 3D IC apta breakthrough density, sed magna-scale mori mori hospites et sustinet virtutis una-chip consilio
Integrated cuneos PCI Express:
-Gen3 X16 Integrated PCIE ad 100g Applications ® modular
Enhanced DSP core:
-Up ad XXXVIII (XXII Teramac) de DSP fuisse optimized ad certa natantis punctum calculations, inter int8, ad plene obviam necessitatibus AI consequentia
