XCVU11P, 3FLGB2104E

XCVU11P-3FLGB2104E Virtex ™ + Ultrascale + ™ FPGA cogitationes providere summa perficientur et integrated functionality in 14nm / 16nm finfet nodis. AMD scriptor tertia-generationem 3D IC usus reclinant silicii Interconnect (SSI) Technology ad conteram limitations de Moore de lege et consequi summum signum processus et Vide I / O Bandwidth in occursum cum Serial Mihi. Etiam providet virtual una-chip consilio amet providere descripserunt fuso lineas inter eu, enabling operationem supra 600mhz et offering ditioribus et magis flexibile horologiorum.

Ut maxime potens FPGA series in industria, Ultrascale + cogitationes sunt perfecta arbitrium ad computationally intensive applications, vndique a I + TB / s retiacula, apparatus discendi ad radar / Monitum systems.

Main Features et commoda

3D-on-3D integrationem:

-Finfet supporting 3D IC apta breakthrough density, sed magna-scale mori mori hospites et sustinet virtutis una-chip consilio

Integrated cuneos PCI Express:

-Gen3 X16 Integrated PCIE ad 100g Applications ® modular

Enhanced DSP core:

-Up ad XXXVIII (XXII Teramac) de DSP fuisse optimized ad certa natantis punctum calculations, inter int8, ad plene obviam necessitatibus AI consequentia