XCVU11P-1FLGC2104E FPGA fabrica supremam actionem praebet et functionem integrationem in 14nm/16nm FinFET nodi praebet.
In XCVU11P-1FLGC2104E FPGA fabrica summam observantiam praebet et functionem integralem in 14nm/16nm FinFET nodi praebet. AMD tertia-generatio 3D IC adhibet technologiam reclinatam interconnect (SSI) technologiam ad limites Legis Moore solvendas et ad summum processum signum consequendum et videndum I/O sed ad arctissimum consilium requisita.
Product attributa
Series: XCVU11P
Numerus partium logicarum: 2835000 LE
Adaptiva Logica Module - ALM: 162000 ALM
Memoriae infixa: 70.9 Mbit
Numerus input/output terminales: 512 I/O
Potentia copia voltage - minimum: 850 mV
Potentia Supple Voltage - Maximum: 850 mV
Minimum temperatura operating: 0 ° C
Maximum operating temperatus: + 100 ° C
Data rate: 32.75 Gb/s
Numerus transceivers: 96 transceivers
Installation style: SMD/SMT
Sarcina/Box: FBGA-2104
Distribuit RAM: 36.2 Mbit
mbedded Block RAM - EBR: 70.9 Mbit
Umor sensus: Sic
Numerus cuneos logicorum ordinatorum - LAB: 162000 LAB
Virtus operandi copia voltage: 850 mV
