ST115G PCB - cum integrated technology progressus in technology et microelectronic packaging, in summa potentia densitas electronic components est crescente corporis magnitudinem dum electronic components electronic apparatu et per gradus tendit ad esse parva et miniaturized, unde calor congeriem in rapid , unde fit per calorem a flux incremento cogitationes integrated in circuitu. Unde summus temperatus environment erit ad afficit components electronic cogitationes, et hoc exigit a pluribus agentibus scelerisque control propositum. Inde est quod calor dissipatio electronic facti components habet a major components et focus in current electronic electronic apparatu manufacturing.
